| 摘要 |
PURPOSE:To prevent a void from occurring at a polyimide film and enable an upper-layer wire to be formed highly accurately by previously forming a chrome or a nickel film on a copper wire only before forming a polyimide insulation layer on the copper wire which is formed by electroless plating. CONSTITUTION:Copper is deposited to a plating seed layer 17 which consists of a copper sputter film within a wiring groove by electroless plating and a copper layer 23 is filled into a wiring groove 22. Further, after a chrome layer 24 is formed on an entire surface on an polyimide insulation layer 18 including the copper layer 23 by sputter deposition, a photo resist layer 25 is formed and the chrome layer 24 is selectively eliminated by an etching liquid for forming the chrome layer 24 on the copper wire only. Finally, with the copper wire, a polyimide precursor varnish is spinner-coated on the insulation layer 18 where a first-layer wiring layer is formed in this manner for forming a polyimide varnish layer, heating is made, and then a polyimide insulation layer 26 is obtained. |
