| 摘要 |
PURPOSE:To uniformly pack resin into cavities by constituting a plurality of the cavities so as to be arrayed in parallel to one another, respectively, on side walls on an outer side of the bent portions of runners via gates. CONSTITUTION:Both of a top force 7 and a bottom force 8 are provided with recessed lead frames. Eight runners 2 are radially extended from a cull 3 and provided in the bottom force 8. Cavities 1 are provided in parallel to one another on an outer side of the bent portions 2a of the runners 2 via gates 4. When the sealing of a resin package in a semiconductor device is performed by using such a resin-sealing metallic mold assembly, this makes it possible to eliminate the short packing of resin, which is caused in cavities on an inner side of the bent portions 2a, and the generation of voids, or troubles such as the deformation of the lead frame, and the short circuit and breaking of wires. |
