PACKAGING OF HYBRID INTEGRATED CIRCUIT

摘要

PURPOSE:To prevent a bonding wire from being extended or burnt out on packaging and transmission characteristics from deteriorating greatly by setting a bonding wire connection point on a signal terminal side to a higher position than that on a hybrid integrated circuit side. CONSTITUTION:A dielectric block 16 of a signal terminal 2 is formed thicker than a dielectric substrate 22 of a hybrid integrated circuit. Then, a bonding wire connection point on a side of the signal terminal 2 is set to a higher position than that on the hybrid integrated circuit side.