| 摘要 |
PURPOSE:To form a loop of an excellent shape having a sufficient height with high operability by bonding the lower ends of wires to a semiconductor chip, then raising a capillary in a circularly bent state in an opposite direction to a loop forming direction, then moving the forming direction and bonding the wires to the electrodes of a board. CONSTITUTION:In a wire bonding method for leading wires 3 wound on a spool from the lower end of a capillary 11 and connecting a semiconductor chip 15 to the electrodes of a board 14 via the wires 3, the capillary 11 is moved down on the chip 15, the lower ends of the wires 3 are bonded to the chip 15, the capillary 11 is then raised in a circularly bent state in an opposite direction N1 to a loop forming direction, then moved to a loop forming direction N2 and the wires 3 are bonded to the electrodes of the board 14. Thus, the wire bonding can be performed while forming the loop of the wire of an excellent shape having a sufficient height, and the moving stroke of the capillary can be shortened. Accordingly, its operating efficiency can be improved. |
