PUNCHING MOULD FOR PRINTED CIRCUITS

摘要

The invention relates to a die for printed circuits punching in view of electronic components mounting. According to the invention, the die comprises punches placed on two coordinates and secured with a pressure plate. A movement equalizer is fastened on the pressure plate in the die pressure centre; the equalizer is covered with a lid comprising a piston equipped with a joggle and a buffer. The punches penetrate the punched holes on a punch-holder plate that has several guiding bushings through which pass guiding columns equipped with spring separators resting on a guiding plate placed on the semi-manufactured part positioned on an active plate.