| 摘要 |
PURPOSE:To sharply reduce frequencies of occurrences of disconnection defect in conductor patterns for controlling bubble in memory element manufacturing processes, by forming a separated conductor layer by leaving it on the upper part of the conductor pattern for controlling bubble besides the bonding pad. CONSTITUTION:A spacer 3, a conductor pattern for controlling bubble 4, another spacer 5, a bubble transferring path pattern 6, a protective film 7, and a conductor made bonding pad 8 are successively piled up in layer on the substrate of a magnetic bubble medium 1. When the conductor layer for bonding pad is formed, at least a separated conductor layer 10 is formed by leaving it, besides the pad 8, on the pattern 4 with the spacer 5 and the protective film 7 in between. As the result of this, even when a pin hole 9 exists, it will not happen that the etching liquid enters into the pin hole 9 and corrodes and disconnects the pattern 4. |
