| 摘要 |
<p>PURPOSE:To obtain the semiconductor acceleration sensor which is tolerant to vibration by connecting an acceleration sensor element and a package by beams which connect the both so that they are floated in a hollow. CONSTITUTION:The package 3 is provided with terminals 2 for electric connections with the outside and the beams 1 for mounting are formed on the terminals 2. The beams 1 and an aluminum pad provided to the fixation part 43 of the acceleration sensor element 10 are connected. The beams 1 are made of stainless steel, and about 1 mm long, 100 mum thick, and 200 mu width. A projection 5 is provided atop of each beam 1 and connected to the aluminum pad to secure a space wherein the sensor element 10 vibrates. The projection 5 is a cube body which is about 100 mum long, width, and thick. Then a cap 4 is provided after the sensor element 10 is connected to the beam 1. Thus, the mounting is completed. The beam 1 is brought into contact with the package 3, so the strength of the beam 1 is improved by the package 3.</p> |
