DATA MEDIUM AND PREPARATION THEREOF

摘要

PURPOSE:To enhance the reliability against the conductive foreign matter or humidity of the outside by burying an integrated circuit device having an IC chip built therein connected thereto in the opening part of a metal case to bond and fix the same by a fixing resin and covering the end surface of a lead part. CONSTITUTION:An integrated circuit device 1 is equipped with an insulating substrate 10 having a terminal pattern 6 formed to one surface thereof and a lead part 12 for plating a circuit pattern 11 formed thereto, the IC chip 13 connected to the circuit pattern 6 by a connector and the seal resin 14 covering the IC chip 13. The integrated circuit device 1 is received in the opening part 8 of a metal case 4 so that the terminal pattern 6 is turned upwardly and the first cut groove 10a and the gap between the metal case 4 and the integrated circuit device 1 are filled with a fixing resin 15 to bond and fix the integrated circuit device 1 to the opening part 8 of the metal case 4. Since the lead part 12 exposed to the outside of the seal resin 14 and the cut end surface of the lead part are covered with and protected by the fixing resin 15, the reliability against the humidity or conductive foreign matter of the outside is ensured.