| 摘要 |
The area of a surface-emitting LED is reduced, and hence the number of LEDs which can be obtained from a single wafer is increased, by a chip design in which the light-emitting spot is positioned asymmetrically toward one corner of the chip. Preferably, an L-shaped contact is formed on the light output surface so that light-emitting spot emerges from between the legs of the L. |
