| 摘要 |
<p>The invention relates to a method of producing circuit boards by utilizing a magnetron sputtering method, in which a circuit board (23) is placed in a chamber (2) to which a magnet-cathode-anode unit (3) is attached, vacuum is created in the chamber and inert gas is introduced into it and a plasma cloud is formed in it by means of an electric and magnetic field, whereby metal atoms break away from the cathode (30) and deposit on the surface of the circuit board (23). In order that the coating process would be technically easy and provide a good coating result, the method of the invention is mainly characterized in that the circuit board (23) is kept at a pressure of 0.015 to 0.1 mb at a distance of 5 to 70 mm from the cathode (30) of the magnet-cathode-anode unit during the plasma coating, whereafter the circuit board (23) is coated galvanically by a pulse galvanization technique. The invention is also concerned with a vacuum chamber unit for use in the production of circuit boards. <IMAGE></p> |
