| 摘要 |
PURPOSE:To prevent thermal fatigue failure of solder by bending a lead terminal passed through a mounting hole so as to temporarily stop the terminal, and soldering the end portion of the lead terminal to a wiring conductor in such a manner as not covering the mounting hole. CONSTITUTION:Prior to connection of a lead terminal 3, a resist layer 5 is formed on the surface of a base 2 and then an opening 5a wider than the end portion of a wiring conductor 1 is formed at the end portion of the wiring conductor 1 in a manner so as not to cover a mounting hole 2a. The L-shaped end of a lead terminal 3 is passed through the hole 2a and the end portion of the terminal 3 is bent into the shape of U in the direction of the lead terminal so that the lead terminal 3 is temporarily stopped. The conductor 1 exposed to the opening 5a is soldered to the end of the terminal 3 so that while solder 4 does not cover the hole 2a the terminal 3 is mechanically and electrically connected to the conductor 1. Tensile stress caused by thermal expansion of the base does not directly act on the soldered portion and therefore thermal fatigue failure of the solder is prevented. |
