发明名称 |
Method of forming flexible metal leads on integrated circuits |
摘要 |
Slide forming tape-automated-bonded leads extending from an integrated circuit chip with a support ring on the leads between the outer periphery of the chip and the outer lead ends. After the leads are formed the support ring remains attached to the vertical portion of the leads opposite the chip. The present invention is well suited for minimizing and footprint on relatively long TAB leads which fan out and require a support ring to maintain proper lead pitch.
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申请公布号 |
US5065504(A) |
申请公布日期 |
1991.11.19 |
申请号 |
US19900608769 |
申请日期 |
1990.11.05 |
申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION |
发明人 |
OLLA, MICHAEL A. |
分类号 |
H01L21/00;H01L21/60;H01L23/498 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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