ALIGNMENT OF LEADS FOR CERAMIC INTEGRATED CIRCUIT PACKAGES

摘要

ALIGNMENT OF LEADS FOR CERAMIC INTEGRATED CIRCUIT PACKAGES An alignment system comprising a rectangular leadframe from the interior of which extend leads to terminations arrangement for alignment and registration with the braze pads of a ceramic integrated circuit package, the alignment and registration being maintained and defined by a web bar interconnecting the leads adjacent and between those braze pads and the leadframe. The leadframe, leads and web bar are integrally formed by etching and lie in a plane.