发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEAD FRAME THEREFOR
摘要 PURPOSE:To use the lead frame material efficiently by a method wherein at least parts of adjacent interline frames to adjoining multi-series lead frames are overlapped with one another. CONSTITUTION:At least parts of adjacent interline frames adjacent to adjoining multi-series lead frames 11A, 11B in muiti-series multi-line lead frames 10 are overlapped with one another to be substantially used commonly between the adjacent lead frames 11A, 11B. The parts of the overlapped interline frames 20 are composed so as to form an extension part of the other part of leads. When a slit 21 is opened in the inter-line frames 20 to divide the adjacent frames 11A, 11B, these frames 11A, 11B are accurately cut off so as to absorb the stress due to the contraction of resin sealing packages 2 in case of forming these packages 2. Next, respective frames 11A, 11B are loaded with mutually different kinds of pellets 25. Finally, adjacent cavities 33 are to be communicated with communicating channels 40 to fill up the respective cavities 33 with resin.
申请公布号 JPH03259556(A) 申请公布日期 1991.11.19
申请号 JP19900058525 申请日期 1990.03.09
申请人 HITACHI LTD 发明人 OKUBO TADASHI;OHASHI YOSHIO;SAKAMOTO TOMOO;NAKAGAWA TAKASHI;ENOMOTO USUKE;OZOEGAWA SUGURU
分类号 H01L21/56;H01L23/48;H01L23/50 主分类号 H01L21/56
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