| 摘要 |
A process for making ultra-thin foil utilizing a copper or copper alloy foil carrier. The foil carrier is pretreated prior to the deposition of the ultra-thin layer of copper or copper alloy thereon. The pretreatment includes cleaning the carrier by treatment with an aqueous acid solution preferably containing an oxidizer, rinsing the carrier and then treating the carrier with an aqueous solution of chromic acid and phosphoric acid to apply a film to the carrier.
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