发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the occurrence of poor elements and misentry, by a method wherein a resin plate previously stamped with characters, symbols and the like is inserted in a metal mold base section and stamping work is simplified by fixing the resin plate to the mold substance of an element by resin molding. CONSTITUTION:An element 1 mounted on a lead frame 2 and connected to wires 3 is housed in a metal mold 4 and sealing mold is made by pouring resins 5. At that time, for example a basic substance 6 consisting of a resin mold plate previously stamped with characters and the like required for indicating the element 1 is inserted at the bottom section of the metal mold 4 by facing the stamped section down wards and the basic substance 6 is molded together with the element 1. In this way, a specified stamp can be fixed at the stage when the element 1 is taken out from the metal mold and work will be simplified. And element breakdown by static electricity at the time of stamping work and misstamping and the like can be prevented.
申请公布号 JPS5760857(A) 申请公布日期 1982.04.13
申请号 JP19800136277 申请日期 1980.09.30
申请人 NIPPON DENKI KK 发明人 ITOU YOSHIO
分类号 H01L23/00;H01L23/28;H01L23/544 主分类号 H01L23/00
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