PROCESS FOR DIP-SOLDERING PRINTED CIRCUIT BOARDS

摘要

2083135 9119414 PCTABS00008 The invention relates to a process for making printed circuit boards with solder pads to be coated with solder which are first surrounded by a resist of given thickness preventing the adhesion of solder; the printed circuit board is then immersed in a solder bath in which the regions to be soldered are covered by a closure; when the printed circuit board is removed from the bath, the closure separates the volume of solder contained in it from the liquid solder in the bath or solder chamber, so that corresponding volumes of solder are defined in the hollow spaces above the solder pads. This has the advantage over the present state of the art that making the closure is simplified and the process of forming the solder pads can be performed separately from the actual dip-soldering procedure.