| 摘要 |
PURPOSE:To adjust the deviation in position of a chip by a method wherein the rectangular chip is sucked by a die collet to be carried and mounted on a substrate placed on a movable table and the chip is observed by a camera to be detected for a slip in position and then the substrate is moved horizontally with the movable table moved. CONSTITUTION:With a die collet 1 reciprocated between a stage 31 and a substrate 20, chips P1, P2... are die-bonded in a straight line on the substrate 20. The deviation in position in the X direction ( x) is adjusted by the following method. The chip P2 is mounted first and then the chip P3 is mounted. Under such a condition, a joint of the chips P2 and P3 is observed by a camera 30. With the chip P3 fastened by being held by the die collet 1, an X table 21 is driven to move the substrate 20 by a distance X in the X direction for making adjustments to the deviation in position in the X direction. Likewise, the deviation in position in the Y direction ( y) is adjusted by moving the substrate 20 in the Y direction after the joint of the chips P2 and P3 is observed by the camera 30. |
