| 摘要 |
<p>PURPOSE:To prevent deterioration in element characteristics and poor mounting as well and to contrive the improvement in reliability, by applying damped vibration to scrabbling work in a mounting method applying vibration to a pellet on melting solder provided on a substrate. CONSTITUTION:A lead tip section 4 is fixed to a Cu substrate,for example, serving as a heat a sink through an aluminum ceramic plate 2 and a melting solder layer 3' is formed on the upper part of the lead tip section 4 to closely attach the reverse side of a pellet 6 to the layer 3'. Next, scrabbling work is performed by vibrating the adsorptive pen 9 of the pellet 6 in both ways and the vibration is changed into damped vibration for scrabbling by using a damped vibration generating circuit consisting of a series circuit of C,L,R, for example. IN this method, the final adhesive position of the pellet 6 can be isolated from the swollen sections created at the opposite ends of the layer 3' and deterioration in revere dielectric strength be solder adhesion can be prevented. Void occurrence into the solder layer can also by checked. Accordingly, deterioration in heat fatigue and the like can be prevented and high reliability can be achieved.</p> |
