发明名称 MOLDING OF FOAM AND MOLD FOR FOAM MOLDING
摘要 PURPOSE:To decrease an amt. of adhesion of a residue caused by decomposition of a blowing agent by heating the neighborhood of the end part of a cavity of a mold by means of a heater heating locally the part. from the time just before a resin is filled in this end part to several sec or min after the filling is finished and cooling thereafter. CONSTITUTION:When a foamable resin compsn. with an amt. which is smaller than the vol. of a mold cavity 1 is injected in the mold cavity 1 while the compsn. is melted, the compsn. fills in the mold cavity 1 and reaches the end part of the mold cavity while it is expanded. When electric current is energized in a heater 5 before the resin compsn. reaches the end part, the end part of the cavity 1 is heated and the temp. is elevated and a gas contg. a decomposed residue of a blowing agent generated from the resin compsn. is not cooled and therefore, the wall of the mold cavity 1 is not adhered with the residue and it is evacuated from a vent channel 4. When the resin is filled in the mold cavity 1, heating is stopped and the temp. of the mold is lowered by passing cold water through a cooling channel 3. When the resin is solidified, cooling is stopped and a product is taken out.
申请公布号 JPH03256719(A) 申请公布日期 1991.11.15
申请号 JP19900055388 申请日期 1990.03.07
申请人 SEKISUI CHEM CO LTD 发明人 ONO TSUKASA
分类号 B29C45/00;B29C45/26;B29K105/04 主分类号 B29C45/00
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