| 摘要 |
<p>PURPOSE:To prevent contamination of the back of a wafer through proper exchange of a clean pad by sucking and holding a thin piece, e.g. a semiconductor, on the clean pad through the third adsorption port and the third suction groove of the clean pad. CONSTITUTION:A first suction port 2, a second suction port 3 in the vicinity of the first suction port 2, and first suction grooves 4 connected to the second suction port 3 are formed in a sucking member 1 surface. A third suction port 22 and second suction grooves 23 connected to the third suction port 22 are formed in a clean pad 21 surface. The clean pad 21 is sucked by the member 1 in a state that the first suction port 2 coincides with the third suction port 22, and a thin piece 25, e.g. a semiconductor wafer, is sucked and held on the clean pad 21 through the third suction port 22 and the second suction grooves 23 of the clean pad 21. During contamination of the surface of the clean pad 21, a second valve 15 is closed to release the member 1 from an suction force, and the clean pad 21 is removed from the member 1. This constitution prevents contamination of the back of a wafer 25.</p> |
