| 摘要 |
PURPOSE:To detect faulty IC without removing the IC mounted on a board, by measuring the DC characteristic of an IC module while heating discretely and locally the IC mounted on the board. CONSTITUTION:An IC module X is prepared by mounting memory ICs 0 to 7 on a board 13, and these ICs 0 to 7 are connected to a receptacle 8 respective ly. Moreover, a direct-current voltage source 9 is connected between a power terminal Vcc of the receptacle 8 and a ground (GND) terminal thereof and a direct-current voltage is impressed. Besides, a direct-current voltage source 10 and an ammeter 11 are connected to a row address strobe input terminal RAS. According to this constitution, hot air is supplied from a heat source to each of the ICs 0 to 7 through a nozzle 12, and an input current of the row address strobe input terminal RAS is measured by the ammeter 11 while the memory ICs 0 to 7 are heated discretely and locally. |
