发明名称 HIGHLY CONDUCTIVE POLYMER THICK FILM COMPOSITIONS
摘要 <p>A thermally curable conductive polymer thick film composition comprising, by weight: (a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer resin; (b) a second thermoplastic resin selected from the group consisting of: (i) about 1-6 parts of at least one thermoplastic polyurethane resin; (ii) about 2-10 parts of at least one thermoplastic polyester resin; or (iii) about 1-10 parts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin; (c) about 0.05-1 part of a tertiary amine; (d) an effective amount of at least one organic solvent capable of substantially dissolving (a), (b), and (c) ingredients; and (e) about 50-80 parts of silver flake.</p>
申请公布号 WO1991017550(A1) 申请公布日期 1991.11.14
申请号 US1991002117 申请日期 1991.03.28
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