| 摘要 |
<p>PURPOSE:To protect a hybrid integrated circuit against deterioration caused by the penetration of moisture into a circuit board so as to improve it in reliability by a method wherein openings are arranged in a staggered manner near external circuit connection terminals provided onto a circuit board included in a hybrid integrated circuit, and the hybrid integrated circuit is externally sealed up with resin. CONSTITUTION:Openings 3 arranged in a staggered manner near external circuit connection terminals 7 are provided to a circuit board 1 where a circuit pattern 2 has been formed. The arrangement of the openings 3 is scarcely restricted by a circuit, being different from that of through-holes contained in the circuit pattern 2, so that the arrangement of the openings can be standardized for a hybrid integrated circuit of the same scale and a punching die required for the processing of the circuit board 1 can be commonly used.</p> |
