| 摘要 |
PURPOSE:To get a multilayer wiring board without a warp and a twist by an inner layer material circuit pattern leaving metallic faces in the periphery excluding four corners. CONSTITUTION:This is one where an inner layer circuit pattern 1 leaves metallic faces 3 in the periphery excluding four corners when manufacturing a multilayer wiring board which is constituted by integrating a laminate where a resin layer is arranged at each upside and/or downside of a required number of inner layer materials where circuits are formed, and outer layer materials are arranged at the outermost sides. The inner layer material is one where an electric circuit is made at the laminate which consists of resin such as phenol resin, resin fluoride, etc., and a base material such as paper, cotton, etc., and a foil such as copper, aluminum, etc., and whose one side or both sides are lined with metals, but it needs to be the one that the inner layer circuit pattern leaves the metallic faces 3 in the periphery excluding four corners. Hereby, the warps and twists of the multilayer can be reduced. |
