发明名称 WARP STRAIGHTENING METHOD FOR SOLDERING CIRCUIT BOARD
摘要 PURPOSE:To shorten the straightening time by executing cold air cooling to a heated soldering circuit board whose warp is straightened mechanically. CONSTITUTION:A soldering circuit substrate 2 fed out by a conveyor 4 from a soldering device 1 is carried by a conveyor 8 into a straightening housing 7 of a straitening device 6, the lower face of the soldering circuit board 2 is supported by a pin 9, the upper face is held down by a floating preventive arm 10, and warp of the soldering circuit board 2 is straightened mechanically to a flat state. Subsequently, in such a state, the soldering circuit board 2 is cooled by feeding cold air whose temperature is lower than a room temperature into the housing 7, and the straightened soldering circuit board 2 is fed out to a conveyor 15 of the next process. In such a way, the straightening time is shortened.
申请公布号 JPH03254386(A) 申请公布日期 1991.11.13
申请号 JP19900049337 申请日期 1990.03.02
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 MATSUOKA TARO;SAEKI TAKAHARU
分类号 B21D1/06;B23K3/00;B23K31/02;B23K101/42;H05K3/22;H05K3/34 主分类号 B21D1/06
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