| 摘要 |
PURPOSE:To enable a thin film at a desired part to be eliminated without damaging the substrate surface below the thin film by eliminating a thin film while measuring the remaining film thickness of the thin film at the region and then adjusting a strength of a beam energy based on the measurement value. CONSTITUTION:Film thickness measurement means 16 and 17 which measure a value corresponding to the thickness of a thin film at a part to be eliminated when an energy beam is to be projected without any contact and a beam strength adjustment means 12 for adjusting a strength of an energy beam based on the measurement value are provided. Then, when the thin film is still thick to some extent, the energy beam is intensified to increase elimination speed. On the other hand, when the thin film becomes thin, the beam strength is weakened to the extent that no damage is given even if the beam is projected onto a substrate surface directly. Thus, a desired part of the thin film which is formed on a supporting substrate can be eliminated without damaging the supporting substrate. |
