Immersion cooling coolant and electronic device using this coolant.

摘要

A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30 DEG C to 100 DEG C and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100 DEG C; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.