| 摘要 |
PURPOSE:To improve heat resistance and heat dissipation by integrating a laminate wherein a resin layer is arranged at each upside and/or downside of a required number of inner layer material where circuits are formed, and outer layer materials are arranged at the outermost sides through an inorganic cover composition. CONSTITUTION:A laminate, wherein a resin layer is arranged at each upside and/or downside of a required number of inner layer materials where circuits are made, and outer layer materials are arranged at the outermost sides through an inorganic cover composition, is integrated. As the resin layer arranged at the upside and/or downside of the inner layer material, the application layer of resin, the base material layer impregnated with resin, or the like is used. Moreover, as the inorganic cover composition, the one, which has thermosetting properties and is in the condition of being dispersed in sol shape in an organic solvent, is used, and it is concretely the partial hydrolysate of alkyltrialkoxysilane, the partial hydrolysate of alkyltrialkoxysilane- tetraalkoxysilane coupling agent, etc. Hereby, heat resistance and heat dissipation improve. |
