| 摘要 |
<p>PURPOSE:To obviate the problems such as the use of selective etching and the management of selective etchant in the case of using the composite film consisting of a resistor and a high conductor by performing the plating of conductor pattern after forming a resistor pattern on an organic insulating board. CONSTITUTION:Copper oxide 2 is formed at the surface of a copper foil 1, and those are stacked on an insulating organic material 3, so that the copper oxide 2 face may contact with said material, so as to form a laminate, and then the laminate is brought into contact with etchant so as to remove the copper foil 1. Next, a catalyst 4 for electroless plating is given to the laminate from which the copper foil 1 is removed, and a resistance film 5 is made by electroless plating, and an etching resist 6 of desired pattern is made. And the resistance film 5 in an unnecessary part is removed by etching, and the etching resist 6 is removed, and a conductor pattern 7 is made by electroless plating. Hereby, the problems such as the use of selective etchant and the management of the selective etchant in the case of using the composite film consisting of a resistor and a high conductor disappear.</p> |
