| 发明名称 |
PROCESS FOR METALLISING MOULDED POLYARYLENE SULFIDE ARTICLES |
| 摘要 |
<p>Printed circuit boards having outstanding electrical and mechanical properties are obtained if special mixtures of polyarylene sulphides and polycarbonates, polyaryl ethers, polyamides, polyesters or rubber elastomers are used as baseboards for the wet-chemical deposition of the conductor pattern and the boards are treated with an oxidising agent prior to activation.</p> |
| 申请公布号 |
EP0379856(A3) |
申请公布日期 |
1991.11.13 |
| 申请号 |
EP19900100066 |
申请日期 |
1990.01.03 |
| 申请人 |
BAYER AG |
发明人 |
SIRINYAN, KIRKOR, DR.;KOHLER, KARL-HEINZ, DR.;REINKING, KLAUS, DR.;RUSSELER, WOLFGANG, DR.;WEHNERT, WOLFGANG, DR. |
| 分类号 |
C08L21/00;C08K7/14;C08L67/00;C08L67/02;C08L69/00;C08L71/12;C08L77/00;C08L81/02;C08L83/04;C23C18/16;C23C18/28;H05K1/03;H05K3/18;(IPC1-7):C23C18/16 |
主分类号 |
C08L21/00 |
| 代理机构 |
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代理人 |
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