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经营范围
发明名称
METHOD OF LEVELING SOLDER BY THE USE OF HIGH FREQUENCY
摘要
申请公布号
JPH03254182(A)
申请公布日期
1991.11.13
申请号
JP19900051945
申请日期
1990.03.01
申请人
NIHON SUPERIASHIYA:KK
发明人
NISHIMURA TETSUO
分类号
H05B6/02;B23K1/00;B23K1/20;H05B6/10;H05K3/24;H05K3/34
主分类号
H05B6/02
代理机构
代理人
主权项
地址
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