Semiconductor chip mounted inside a device hole of a film carrier.

摘要

A semiconductor device comprises a semiconductor chip (2) inside a device hole (3) of a film carrier (1) having a conductive pattern (4) formed thereon, wherein inner leads (5) projecting from leads of the conductive pattern (4) into the device hole (3) are respectively connected to terminals provided on the semiconductor chip (2), and the semiconductor chip (2) or the semiconductor chip and portions of the conductive pattern (4) are sealed with a sealing resin (8). The width of a gap formed between the edge of the device hole (3) and the outer periphery of the semiconductor chip (2) is 0.4 mm to 0.8 mm. Bent portions may be provided substantially at a midway position on said inner leads. Further, cut-out portions may be provided beside each lead of the conductive pattern (4) in the edge of the film carrier (1) surrounding the device hole (3). These features make the inner leads more pliant and/or avoid concentration of stress imported on the inner leads, so that lead brakes and poor bonding connections are substantially prevented. <IMAGE>