THERMAL TRANSFER PLATE AND INTEGRATED CIRCUIT CHIP OR OTHER ELECTRICAL COMPONENT ASSEMBLIES INCLUDING SUCH PLATE

摘要

A thermal transfer plate for removing heat to a heat sink or cooling fins positioned between an electrical component and a mounting surface. The plate comprises a heat conductive material which is in thermal communication with the electrical component and extends beyond the electrical component to establish thermal communication with a heat sink or cooling fins. In one specific embodiment, the thermal transfer plate has a base portion with upright side walls which form a socket to receive the electrical component. Horizontal cooling fins are located at the top of the sidewalls. The cooling fins can be of any shape which will perform the cooling or heat sink function and can be made with openings which permit air to circulate through the cooling fins. Moreover, due to its efficient heat transfer capabilities, the thermal transfer plate could be thermally connected to a separate heat sink device.