| 摘要 |
An improved thermoelectric device and fabrication process wherein in a first embodiment strips of conductive material are attached to corresponding strips of adhesive material and first and second patterned arrays of tabs are struck from the strips onto the adhesive strips. In a second embodiment strips of conductive material are blanked to form the first and second patterned arrays of tabs and substantially simultaneously therewith the arrays of tabs are partially returned to their strips which now serve as support frames for the tab arrays. The array of tabs have either flat rectangular surfaces or flat peanut shaped surfaces with or without round shaped pockets adjacent to each end. Round pockets are used to receive legs of thermoelectric material of any shape without orientation. The first and second patterned tab arrays are attached to plates of insulation material and the adhesive strips or the strip frames removed, as applicable, to form first and second side plates. Then legs of thermoelectric material are attached to ends of conductive tabs of the arrays of tabs as appropriate to complete the thermoelectric device.
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