发明名称 GLASS CERAMIC MULTILAYER INTERCONNECTION BOARD
摘要 PURPOSE:To increase the adhesion between a substrate and polyimide on the substrate surface, and prevent the polyimide from exfoliating, by forming a flange type metal ring on the substrate periphery corresponding with the part under the interface of a polyimide layer to be laminated. CONSTITUTION:A metal ring 12 is fixed so as to surround the side surface of a glass ceramic substrate GCS 11. The end surface of a polyimide layer 13 is put on the ring 13, and said layer is laminated. Thereby, when the GCS 11 is corroded by chemical liquid like acid and alkali, the polyimide interface is not affected, and the adhesion of the interface between the polyimide and the substrate is increased. Hence the exfoliation of the polyimide can be prevented.
申请公布号 JPH03253096(A) 申请公布日期 1991.11.12
申请号 JP19900050871 申请日期 1990.03.02
申请人 NEC CORP 发明人 ISHIDA HISASHI
分类号 H05K3/46 主分类号 H05K3/46
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