发明名称 |
CIRCUIT PACK WITH INBOARD JET COOLING |
摘要 |
CIRCUIT PACK WITH INBOARD JET COOLING Disclosed is a means for cooling heat generating components mounted on the front surface of printed circuit boards. A conduit member is attached to the back surface of the board to form a sealed plenum and to provide direction of cooling fluid toward the components. Holes in the board establish cooling jets directed at the components from the plenum.
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申请公布号 |
CA2039058(A1) |
申请公布日期 |
1991.11.12 |
申请号 |
CA19912039058 |
申请日期 |
1991.03.26 |
申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
AZAR, KAVEH |
分类号 |
H01L23/473;H05K1/02;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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