HYBRID INTEGRATED CIRCUIT COMPONENT AND ASSEMBLY THEREOF,申请号JP19900050181-传众专利搜索

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发明名称	HYBRID INTEGRATED CIRCUIT COMPONENT AND ASSEMBLY THEREOF
摘要
申请公布号	JPH03252192(A)	申请公布日期	1991.11.11
申请号	JP19900050181	申请日期	1990.03.01
申请人	TAIYO YUDEN CO LTD	发明人	OGAWA YASUO
分类号	H05K1/14;H05K3/34;H05K3/36	主分类号	H05K1/14
代理机构		代理人
主权项
地址

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