OUTER LEAD MOLDING PROCESS OF SEMICONDUCTOR ELEMENT,申请号JP19900047507-传众专利搜索

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发明名称	OUTER LEAD MOLDING PROCESS OF SEMICONDUCTOR ELEMENT
摘要
申请公布号	JPH03250756(A)	申请公布日期	1991.11.08
申请号	JP19900047507	申请日期	1990.02.28
申请人	TOSHIBA CORP	发明人	MIYAMOTO MITSUGI
分类号	H01L23/50;H05K13/00;H05K13/04	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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