发明名称 ULTRASONIC WIRE BONDING DEVICE
摘要 PURPOSE:To eliminate bonding variations induced by the directional property of a lead frame with respect to vibrating directions by mounting a welding jig to a twisting vibration horn which is making a twisting motion. CONSTITUTION:A welding jig 2 is mounted to the lower end of a twisting vibration horn 1. The welding jig 2 is lowered with the twisting vibration horn 1 in such a manner that the welding jig 2 presses slightly a lead wire 5 on a lead frame 4 set to a base 3. Then, the vibration from a twisting vibrator is transmitted to the twisting vibration horn and provides the twisting vibration to the welding jig 2, thereby bonding the lead wire 5 with the lead frame 4. It is, therefore, possible to eliminate bonding variations induced by the lead frame direction with respect to the vibrating directions.
申请公布号 JPH03250640(A) 申请公布日期 1991.11.08
申请号 JP19900045809 申请日期 1990.02.28
申请人 SHIMADA PHYS & CHEM IND CO LTD 发明人 ANDO HIDEKAZU
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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