| 摘要 |
PURPOSE:To prevent breakage of bonding wire and the like due to the slack of the wire, in the case lead frames having semiconductor chips are transferred to a metal mold press for resin sealing and automatically loaded, by holding both sides of the lead frames. CONSTITUTION:The lead frames wherein the semiconductor chips are attached are loaded in a magazine 7 and enclosed in a container 8. The lead frame is inserted between movable rails 24 and 25 of a moving plate 23 for transferring the frame to the molding press 15 by a loader (not shown). The movable rails 24 and 25 are rotated right and left, receive the frame, and hold it at accurate locations by positioning pins. The frame is transferred to the molding press 15, fixxed to accurate locations by positioning pins on the press, and a resin molding precoss is performed. Since the frame is held by the moving plate 23, the slack is not caused, the breakage of the bonding wire is not caused, and the accurate loading can be performed. |
