发明名称 AGGREGATED CIRCUIT BOARD AND METHOD OF MOUNTING THE SAME
摘要 PURPOSE:To improve the productivity of a circuit board by dividing one circuit board material into the even number of regions with the same configuration, equalizing the numbers of the regions with the same wiring pattern on one and the other surfaces of the circuit board material and making mounting patterns on both the surfaces of the circuit board material the same as each other. CONSTITUTION:In unit regions 5 and 6, first wiring patterns 11 are formed on surfaces 5a and 6a positioned within one surface 2a of a circuit board material 2 and second wiring patterns 12 are formed on surfaces 5b and 6b positioned within the other surface 2b of the circuit board material 2. In two other unit regions 7 and 8, the second wiring patterns 12 are formed on surfaces 7a and 8a positioned within the one surface 2a of the circuit board material 2 and the first wiring patterns 11 are formed on surfaces 7b and 8b positioned within the other surface 2b of the circuit board material 2. Therefore, the wiring patterns on the whole surfaces 2a and 2b of the circuit board material 2 are the same as each other. Thus, the productivity of an aggregated circuit board can be improved.
申请公布号 JPH03250800(A) 申请公布日期 1991.11.08
申请号 JP19900048537 申请日期 1990.02.28
申请人 SONY CORP 发明人 KOMORI KIKUO
分类号 H05K13/04;H05K1/02;H05K3/00;H05K3/30 主分类号 H05K13/04
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