| 摘要 |
PURPOSE:To prevent a crack of resin from occurring at the upper end of an inner lead for electric connection and eliminate deterioration in appearance of a semiconductor device and breakage of fine metal lines by placing sealing resin at least partially between an insulating film and the inner lead for electric connection. CONSTITUTION:A surface facing a semiconductor element 1 of a non-connected part 3b of a fine metal line of a shared inner lead 3 is made thinner than a thin metal line connection part 3a being recessed in the widthwise direction. Resin 8 is interposed between the non-connected part 3b of the fine metal line on which a thin part 3c of the shared inner lead 3 and an insulating member 2. Thus by making thin the non-contacted part 3b of the thin metal line of the shared inner lead 3, the resin 8 can be interposed between the shared inner lead 3 and the insulating member 2, so that a peeled part of an interface with the resin 8 can be limited to at least an interface between the shared inner lead 3 and the resin 8. Thus since a large stress does not occur on the upper end of the shared inner lead 3, it is possible to prevent a crack of the resin from occurring at this part. |
