发明名称 HIGHLY HEAT-RESISTANT EPOXY RESIN COMPOSITION
摘要 PURPOSE:To provide the subject composition containing a specific phenolic compound having imide group, a polyfunctional epoxy compound, a polyfunctional maleimide compound, an inorganic filler and a curing catalyst as essential components, having excellent workability and curability and giving a cured product having excellent heat-resistance and moisture-resistance. CONSTITUTION:The objective composition contains, as essential components, (A) a phenolic compound having imide group and produced by reacting (i) 100 pts.wt. of a phenolic compound containing allyl group (preferably o-allylphenol, etc.) with (ii) 10-500 pts.wt. of a monomaleimide compound of formula (R1 is H or OH; Ar is 6-20C bivalent aromatic residue) [preferably N-(4-hydroxyphenyl) maleimide, etc.] at a functional group ratio (maleimide group/allyl group) of 0.5-3.0, (B) a polyfunctional epoxy compound, (C) a polyfunctional maleimide compound (e.g. N,N'-4,4'-diaminodiphenylmethane bismaleimide), (D) an inorganic filler (preferably silica powder) and (E) a curing catalyst (preferably an organic phosphine).
申请公布号 JPH03247621(A) 申请公布日期 1991.11.05
申请号 JP19900042498 申请日期 1990.02.26
申请人 SUMITOMO BAKELITE CO LTD 发明人 HIRATA AKIHIRO
分类号 H01L23/29;C08G59/40;C08G59/62;C08K13/02;C08L63/00;H01L23/31 主分类号 H01L23/29
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