| 摘要 |
PURPOSE:To enlarge an optical transmission circuit in a rage of operating temperature by a method wherein a semiconductor laser and its driving circuit are housed in the same package, a heat sink is thermally isolated, and furthermore a heat insulating material is interposed between the base of the laser and the package. CONSTITUTION:A drive IC 2 mounted in a ceramic package is fixed to a printed board 4 where a wiring pattern has been provided. A laser 3 in which a light emitting element and an electronic cooling element are built is fixed to the inner face of an Al package 10 by a screw 9. A heat sink 5 of the IC 2 is fixed to the stud of the IC 2 package by a nut 7 through the intermediary of a heat insulating material 8. The heat sink 6 of the laser 3 is fixed to the outer base of the package 10 by the screw 9. The heat sinks 5 and 6 are subjected to an alumite processing to be lessened in thermal resistance, and the heat insulating material 8 is formed of a Teflon resin plate 1mm in thickness. |
