发明名称 METHOD FOR MOLDING MOISTURE REMOVING DEVICE
摘要 <p>PURPOSE:To smoothly mold a moisture removing device having no possibility of the corrosion of an electrode and enhanced in reliability by molding a boss part at first and eliminating the exposure of the electrode from a resin part by hermetically sealing the electrode in a resin by two-stage molding. CONSTITUTION:The electrodes 2a, 2b are bonded to both surfaces of the periphery of a solid electrolyte membrane 1 and wrapped in a resin in a ring shape. At this time, the solid electrolyte membrane 1 and the electrodes 2a, 2b applying voltage to both surfaces thereof are supported in molds 5a, 5b at first by the first stage molding and, in this stage, a boss part is formed by the first resin 3a. A final shape is formed by the second resin 3b in the next second stage molding process in such a state that the boss part is supported by molds 6a, 6b. That is, since the boss part is molded at first and the electrodes are hermetically sealed in the resins by two-stage molding, a highly reliable moisture removing device wherein the electrodes are not exposed from the resin part and there is no possibility of the corrosion of the electrodes can be molded.</p>
申请公布号 JPH03245813(A) 申请公布日期 1991.11.01
申请号 JP19900041577 申请日期 1990.02.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJITA MASAMICHI
分类号 B01D53/26;B01D53/32 主分类号 B01D53/26
代理机构 代理人
主权项
地址