发明名称 Process for bonding copper-based alloys with shape-memory effect by liquid phase diffusion welding
摘要 The process for bonding copper-based alloys with shape- memory effect by liquid phase diffusion welding comprises a technique through which diffusive processes are encouraged under specific temperature and pressure conditions to achieve an alloy composition with a low melting point; a technique which comprises the following stages: A) Optimally roughening the metal surfaces of the base material having shape-memory effect and of the intermediary which will be joined. B) Encouraging diffusion processes under the effect of heat and pressure, in vacuum or under controlled atmosphere, until an alloy composition having a low melting point is reached. C) Increasing the temperature without applying load and in a controlled and/or inert atmosphere until the melting point of the low melting point alloy is reached. D) Maintaining the whole at the melting temperature for the time necessary for the alloy to be completely melted.
申请公布号 ES2021487(A6) 申请公布日期 1991.11.01
申请号 ES19890004309 申请日期 1989.12.20
申请人 UNIVERSIDAD COMPLUTENSE DE MADRID. 发明人 CALVO CALVO FELIPE ANGEL;GOMEZ DE SALAZAR Y CASO DE LOS COBOS. JOSE M;MENDEZ MARTIN. JAVIER;GUILEMANY CASADEMON. JOSEP M
分类号 B23K28/00;C22C9/00;(IPC1-7):C22C9/00 主分类号 B23K28/00
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