发明名称 Semiconductor device contact pads
摘要 In order to reduce the effect of the stray capacitance associated with a contact pad formed on an insulating layer 15 of an integrated circuit a region 20 of opposite conductivity type to the surrounding epitaxial region 16 is formed immediately below the contact pad 11. This region 20 floats electrically and the capacitance C22 associated with the junction appears in series with that (C101) between the pad 11, (12) and the semiconductor. The pad 11 may be connected by the track 12 to an input protection circuit including a diffused resistor 23. The floating zone 20 may be produced at the same time as resistor 23. <IMAGE>
申请公布号 GB2243485(A) 申请公布日期 1991.10.30
申请号 GB19900009500 申请日期 1990.04.27
申请人 * MOTOROLA GMBH 发明人 MANFRED * PAUL;ALLEN * WAGNER;RAY * SUNDSTROM
分类号 H01L23/485;H01L27/02 主分类号 H01L23/485
代理机构 代理人
主权项
地址