| 摘要 |
PURPOSE:To obtain a non-magnetic copper alloy for deformed bars excellent in heat resistance, direct wire bonding properties, adhesion with resins, solderability and heat conductivity by specifying a compsn. constituted of Zr and Cu. CONSTITUTION:A copper alloy used as a deformed bar employed as a lead frame material for power transistors and power ICs is formed of 0.015 to 0.03% Zr and the balance copper with inevitable impurities. In this way, various properties such as electric conductivity equal to that of oxygen free copper, direct wire bonding properties, adhesion with resins and non-magnetic properties are maintained as well as high heat resistance is maintained, so that the deterioration of its strength caused by heating in the case of packaging is eliminated as well as the yield of products is improved and their packaging cost can be reduced. |
