EPOXY RESIN COMPOSITIONS FOR SEALING SEMICONDUCTOR DEVICES

摘要

PCT No. PCT/KR89/00003 Sec. 371 Date Oct. 10, 1989 Sec. 102(e) Date Oct. 10, 1989 PCT Filed Feb. 15, 1989 PCT Pub. No. WO89/07627 PCT Pub. Date Aug. 24, 1989.Disclosed are epoxy resin compositions comprising essentially (A) multi-functional epoxy resins, (B) imide-modified silicone compounds, (C) phenolic novolaks having more than 2 OH groups, and (D) inorganic fillers. When cured, these compositions have excellent processability and lower internal stress as compared to a similar composition without the imide-modified silicone compounds. These compositions are useful for sealing semiconductor devices or other molding applications.